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Different kinds of imaging are used in many sectors as security technology, transport, life science, medicine and industrial technology. Frequently the simultaneous imaging in different spectral regions is beneficial and several distinct systems for example for visible and infrared imaging are employed in parallel. The use of distinct cameras has several disadvantages as a high cost for independent cameras and the effort needed to interconnect the cameras and meaningfully fuse their signals.
MUTIVIS will develop a multispectral sensor technology by integrating visible, infrared, and terahertz pixels monolithically on a CMOS chip. Furthermore it will develop a terahertz source which will add spectroscopic analysis functionality when integrated into a source-camera system. As a pilot application, a demonstrator of such a system will be evaluated in a security environment.
- Robert Bosch GmbH (Bosch) - Project Coordinator
- Comissariat à l’Energie Atomique - Laboratoire d’Electronique et Technologies d’Information (CEA-LETI)
- Fondazione Bruno Kessler (FBK)
- Rainbow Photonics AG (RP)
- Unique, Flughafen Zürich AG (FZ)
- Swiss Federal Institute of Technology Zurich (ETH)
The main role of FBK will be to concept and design the IR and THz readout integrated circuit as well as the visible sensor in the same chip, containing all the necessary signal processing and conditioning. Moreover, FBK will contribute to the design of the subsystem electronic controller.