The human eye is an incredible sensor: it can, as an example, adapt to a huge variety of illumination conditions. On the other hand, conventional cameras typically are blinded by light or sudden scene intensity change. For automotive applications where a human-like vision capability is required, the image sensor Dynamic Range (DR), defined by the ratio of the maximum non-saturating signal to the minimum detectable signal, is a quality index of paramount importance.
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There are wavelenghts which cannot be sensed directly by CMOS devices because, simply, silicon is transparent to that radiation. Thermal infrared radiation, from 8 to 14 micrometers of wavelength, is one of these and usually takes advantage from bolometers technology for detection. Nevertheless, CMOS is still fundamental for the readout integrated circuit and by employing on-chip signal processing it can solve or mitigate many of the drawbacks that the bolometers technology has, such as the relatively large non-uniformity and the thermal drifts due to self-heating processes.
Fluorescence Lifetime Imaging Microscopy (FLIM) is a powerful tool for the analysis of biological samples, enabling the extraction of more information by detecting not only the intensity of the fluorescence but also its lifetime.
FBK ultra-low power cameras detecting the activity of the scene while overlooking the irrelevant parts
The IRIS Research Unit, in collaboration with TeV Research Unit (https://tev.fbk.eu/), has developed two sub-mW vision sensors, with VGA and QVGA resolution, embedding event detection capability. The two cameras are targeted to long-lasting battery-operated applications.
The first developments in 3D Vision at SOI were done in the framework of the Opto3D project since year 2000, with the development of an intelligent electro-optical sensor for driving scenarios detection and object recognition . Since then, SOI investigated and developed a number of different operating principles for indirect time-of-flight imaging using CMOS technologies, from the simulation and development of the sensing device, to the integrated circuit and 3D camera system.