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Multispectral and THz


The paper "Analysis Of CMOS 0.13µm Test Structures For 0.6 To 1.5THz Imaging" has been accepted at the 38th Annual International Conference on Infrared, Millimeter, and Terahertz Waves. It will be held in Mainz, Germany, on September 1 - 6, 2013, at the Congress Center Mainz (Rheingoldhalle).


There are wavelenghts which cannot be sensed directly by CMOS devices because, simply, silicon is transparent to that radiation. Thermal infrared radiation, from 8 to 14 micrometers of wavelength, is one of these and usually takes advantage from bolometers technology for detection. Nevertheless, CMOS is still fundamental for the readout integrated circuit and by employing on-chip signal processing it can solve or mitigate many of the drawbacks that the bolometers technology has, such as the relatively large non-uniformity and the thermal drifts due to self-heating processes.


Mutivis (Multispectral Terahertz Infrared and Visible Imaging and Spectroscopy) is a EU funded project under the 7th Framework Programme aiming at developing a monolithic image sensor with trispectral capabilities and a complete imaging and spectroscopy system.

Main activities

Multispectral imaging adds the wavelength as another variable capable of increasing the information carried by an image. Since 2005, the SOI research unit directed research efforts beyond the visible range, exploring x-ray, infrared and terahertz radiation as regions of strong interest for imaging.